Sr. Packaging Engineer salary at Qualcomm Technologies, Inc.
Based on 4 certified work-visa filings, the median filed wage is $127,200. That is 0% above the $127,000 median across all employers filing this title.
Median
$127,200
25th pct
$125,259
75th pct
$134,613
90th pct
$147,957
Filings
4
$119,434$148,645
How Qualcomm Technologies, Inc. compares
Other employers filing Sr. Packaging Engineer
| Employer | Filings | Median | vs. this page |
|---|---|---|---|
| Qualcomm Technologies, Inc. | 4 | $127,200 | — |
| Emd Millipore Corporation | 2 | $143,217 | +13% |
| Nxp USA, INC. | 2 | $132,355 | +4% |
| Worklance INC. | 2 | $117,520 | -8% |
| Zenith Home Corp | 2 | $115,338 | -9% |
| Becton, Dickinson and Company | 2 | $112,500 | -12% |
Individual filings
Certified determinations for this role
| Location | Wage | Prevailing | Level | Visa | Decided |
|---|---|---|---|---|---|
| Austin, TX | $127,200 | $110,656 | II | H-1B | Aug 20, 2025 |
| Santa Clara, CA | $156,853 | $156,853 | II | H-1B | Aug 20, 2025 |
| San Diego, CA | $127,200 | $119,434 | II | H-1B | Mar 11, 2025 |
| San Diego, CA | $119,434 | $119,434 | II | H-1B | Jan 24, 2025 |
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Sr. Packaging Engineer across all employers →
Market rate for this role
Figures are base salary as filed with the US Department of Labor and exclude bonus and equity. SponsorWage does not provide immigration advice.