Packaging Engineer salary at Qualcomm Technologies, Inc.
Based on 5 certified work-visa filings, the median filed wage is $119,434. That is 0% above the $119,434 median across all employers filing this title.
Median
$119,434
25th pct
$119,434
75th pct
$119,434
90th pct
$132,257
Filings
5
$119,433$119,436
How Qualcomm Technologies, Inc. compares
Other employers filing Packaging Engineer
| Employer | Filings | Median | vs. this page |
|---|---|---|---|
| Intel Corporation | 70 | $123,490 | +3% |
| Qualcomm Technologies, Inc. | 5 | $119,434 | — |
| Intellectt Inc | 3 | $115,200 | -4% |
| Tesla, Inc. | 3 | $107,682 | -10% |
| Gray Architects & Engineers PSCPC | 2 | $74,048 | -38% |
Individual filings
Certified determinations for this role
| Location | Wage | Prevailing | Level | Visa | Decided |
|---|---|---|---|---|---|
| Santa Clara, CA | $140,805 | $140,805 | — | H-1B | Mar 18, 2025 |
| San Diego, CA | $119,434 | $119,434 | II | H-1B | Feb 21, 2025 |
| Austin, TX | $98,500 | $98,030 | II | H-1B | Feb 6, 2025 |
| San Diego, CA | $119,434 | $119,434 | II | H-1B | Feb 6, 2025 |
| San Diego, CA | $119,434 | $119,434 | II | H-1B | Feb 6, 2025 |
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Market rate for this role
Figures are base salary as filed with the US Department of Labor and exclude bonus and equity. SponsorWage does not provide immigration advice.