Semiconductor Packaging Engineer visa sponsorship salary
Across 3 certified work-visa filings, the median wage for Semiconductor Packaging Engineer is $151,012. The middle half of filings fall between $148,936 and $153,271, and the top decile begins at $154,626. Classified under SOC 17-2072.00 (Electronics Engineers, Except Computer).
Median
$151,012
25th pct
$148,936
75th pct
$153,271
90th pct
$154,626
Filings
3
$146,859$155,530
Who pays what for Semiconductor Packaging Engineer
Ranked by number of certified filings
| Employer | Filings | 25th | Median | 75th |
|---|---|---|---|---|
| Nxp USA, INC. | 3 | $148,936 | $151,012 | $153,271 |
Individual filings
Most recent certified determinations
| Employer | Location | Wage | Level | Decided |
|---|---|---|---|---|
| Nxp USA, INC. | Austin, TX | $146,859 | IV | May 29, 2025 |
| Nxp USA, INC. | Austin, TX | $155,530 | II | May 9, 2025 |
| Nxp USA, INC. | Austin, TX | $151,012 | III | Nov 22, 2024 |
Prevailing wage levels I through IV reflect the experience and responsibility the employer attested to, not seniority titles. A level I filing is an entry-level determination; level IV is fully competent and independent. Comparing across levels explains much of the spread between the 25th and 90th percentile above.