Packaging R&d Engineer visa sponsorship salary
Across 3 certified work-visa filings, the median wage for Packaging R&d Engineer is $181,314. The middle half of filings fall between $179,257 and $186,660, and the top decile begins at $189,867. Classified under SOC 11-9041.00 (Architectural and Engineering Managers).
Median
$181,314
25th pct
$179,257
75th pct
$186,660
90th pct
$189,867
Filings
3
$177,200$192,005
Who pays what for Packaging R&d Engineer
Ranked by number of certified filings
| Employer | Filings | 25th | Median | 75th |
|---|---|---|---|---|
| Intel Corporation | 3 | $179,257 | $181,314 | $186,660 |
Individual filings
Most recent certified determinations
| Employer | Location | Wage | Level | Decided |
|---|---|---|---|---|
| Intel Corporation | Austin, TX | $192,005 | III | Aug 7, 2025 |
| Intel Corporation | Round Rock, TX | $181,314 | III | Jun 10, 2025 |
| Intel Corporation | Chandler, AZ | $177,200 | III | Apr 30, 2025 |
Prevailing wage levels I through IV reflect the experience and responsibility the employer attested to, not seniority titles. A level I filing is an entry-level determination; level IV is fully competent and independent. Comparing across levels explains much of the spread between the 25th and 90th percentile above.