Microelectronics Packaging Thermal Engineer visa sponsorship salary
Across 1 certified work-visa filings, the median wage for Microelectronics Packaging Thermal Engineer is $166,060. The middle half of filings fall between $166,060 and $166,060, and the top decile begins at $166,060. Classified under SOC 17-2061.00 (Computer Hardware Engineers).
This is one of many job titles filed under Computer Hardware Engineers. That page pools every variant, so its figures rest on far more filings than this one.
- Median
- $166,060
- 25th pct
- $166,060
- 75th pct
- $166,060
- 90th pct
- $166,060
- Filings
- 1
Individual filings
Most recent certified determinations
| Employer | Location | Wage | Level | Decided |
|---|---|---|---|---|
| IBM Corporation | Hopewell Junction, NY | $166,060 | IV | May 19, 2025 |
Prevailing wage levels I through IV reflect the experience and responsibility the employer attested to, not seniority titles. A level I filing is an entry-level determination; level IV is fully competent and independent. Comparing across levels explains much of the spread between the 25th and 90th percentile above.