Microelectronics Packaging Thermal Engineer visa sponsorship salary
Across 1 certified work-visa filings, the median wage for Microelectronics Packaging Thermal Engineer is $166,060. The middle half of filings fall between $166,060 and $166,060, and the top decile begins at $166,060. Classified under SOC 17-2061.00 (Computer Hardware Engineers).
Median
$166,060
25th pct
$166,060
75th pct
$166,060
90th pct
$166,060
Filings
1
Individual filings
Most recent certified determinations
| Employer | Location | Wage | Level | Decided |
|---|---|---|---|---|
| IBM Corporation | Hopewell Junction, NY | $166,060 | IV | May 19, 2025 |
Prevailing wage levels I through IV reflect the experience and responsibility the employer attested to, not seniority titles. A level I filing is an entry-level determination; level IV is fully competent and independent. Comparing across levels explains much of the spread between the 25th and 90th percentile above.