Microelectronics Packaging Engineer visa sponsorship salary
Across 1 certified work-visa filings, the median wage for Microelectronics Packaging Engineer is $100,402. The middle half of filings fall between $100,402 and $100,402, and the top decile begins at $100,402. Classified under SOC 17-2131.00 (Materials Engineers).
Median
$100,402
25th pct
$100,402
75th pct
$100,402
90th pct
$100,402
Filings
1
Individual filings
Most recent certified determinations
| Employer | Location | Wage | Level | Decided |
|---|---|---|---|---|
| Allegro MicroSystems, LLC | Manchester, NH | $100,402 | II | Apr 29, 2025 |
Prevailing wage levels I through IV reflect the experience and responsibility the employer attested to, not seniority titles. A level I filing is an entry-level determination; level IV is fully competent and independent. Comparing across levels explains much of the spread between the 25th and 90th percentile above.